DSOM-110R Rockchip RK3568 System on Module (SOM) / Core Board

13 Dec.,2023

 

The vacuum bag is found to be broken before unpacking.

After unpacking, the bag is found to be without a humidity indicator card.

The humidity indicator card reads 10% or more after unpacking, and the color ring turns pink.

Total exposure time after unpacking exceeds 168 hours.

More than 12 months from the date of the first sealed packaging.

Baking parameters are as follows:

Baking temperature: 60°C for reel packs, humidity less than or equal to 5% RH; 125°C for tray packs, humidity less than or equal to 5% RH (high-temperature-resistant trays, not blister packs for tow trays).

Baking time: 48 hours for reel packaging; 12 hours for pallet packaging.

Alarm temperature setting: 65°C for reel packs; 135°C for pallet packs.

After cooling to below 36°C under natural conditions, production can be carried out.

If the exposure time after baking is greater than 168 hours and not used up, bake again.

If the exposure time is more than 168 hours without baking, it is not recommended to use the reflow soldering process to solder this batch of modules. The modules are class 3 moisture-sensitive devices and may become damp when the exposure time is exceeded. This may lead to device failure or poor soldering when high-temperature soldering is carried out.

For more information ROCKCHIP SOM, please get in touch with us!